Like any successful system-on-chip (SoC) effort, a multi-die system-in-package (SiP) project must start with a sound system design. But then what? Are the steps in the SiP design flow different from ...
A new technical paper titled “Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration” was published by researchers at University ...
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